LINQTAPE Dicing and Backgrinding tapes are tapes specifically designed to be used in semiconductor and electronics manufacturing processes. These tapes feature a strong adhesive system designed for secure wafer handling during critical processes such as dicing and thinning. By utilizing high-performance materials with advanced adhesive properties, the tapes enhance both process efficiency and wafer yield, all while reducing the risk of damage during cutting and grinding operations.
The dicing and backgrinding tapes are engineered to be tough, offering superior adhesion during wafer processing while utilizing UV Removable technology. This allows them to remain easily removable without leaving residue or compromising the wafer’s integrity. Unlike traditional alternatives, these tapes maintain their reliability and performance even under the stress of high-speed cutting and grinding, offering enhanced service life and reducing operational costs. They are ideal for sensitive applications and substrates such as glass, electronics, etc.