Solder spheres, commonly know as solder balls are the most common way to electrically interconnect flip chip semiconductors. CSPs , BGAS, LBGA are all arrays with small size factor that don\'t use bonding wires but use solder spheres beneath the package to aid with the miniaturization of the integrated circuits. Solder spheres come in multiple diamteres ranging from 0.075mm to 0.9mm and can fit in many package designs. There are multiple solder sphere alloys that can prove more or less reliable and can melt on a variety of temperatures. Normal spheres have a solidus (still solid) and a liquidus (liquid) temp with a gel like structure in between to aid with the bonding process. Eutectic solder spheres on the other hand have a very precise temperature where they switch from solid to liquid. This can help with tightly designed processes with very strict temperature requirements.
After many years of testing and debating, and with specific exceptions, the semiconductor industry has largely settled on the use of Tin (Sn), Silver(Ag), Copper(Cu) - or SAC - alloy for the assembly of lead-free products. Although the SAC alloy has been settled, which SAC alloy to use is still up for debate. North American and Europe manufacturers favor SAC305 (Sn3.0Ag0.5Cu), while Asian manufacturers generally favor SAC405 (Sn3.8Ag0.8Cu).
Whether you call them solder spheres or solder balls, KRAYDEN has been the premium supplier of solder balls since 2004. While many companies may offer solder spheres, very few companies offer the breadth and selection that KRAYDEN offers. Whether you are looking for eutectic Tin-Lead (SnPb) solder, high lead solder or lead-free variations, including Tin-Ag-Copper (SAC), Bismuth/Tin (BiSn), pure Tin (Sn), pure Indium (In) KRAYDEN has got you covered. We also offer low minimum order quantities and custom grades. Can\'t find the solder ball alloy you need? Let us know and we\'ll help you out.