Phase change materials (PCM) are often used as matrix materials for thermal interface applications, because they are solid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bondline and high reliability without pump-out issues. This is achieved by adding a TC filler to the PCM matrix which forms a phase change composite with high heat transfer performance.
We offer silicone free, thermally conductive Phase Change Materials in both pad and paste formats. These products are designed to minimize thermal resistance at interfaces and maintain stable performance through the rigorous reliability testing required for long product life applications. Pastes are exactly the same as the pad versions with the addition of solvent that makes them screen printable and ideal for IGBT.
Based on a robust polymer PCM structure, these materials exhibit effective wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. With a breakdown temperature of ~180°C they provide superior reliability and maintain low thermal impedance, making PCM desirable for high-performance integrated circuit devices.